• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    At least one of the methods of thermally processing a workpiece or component, in particular a solder joint disposed on the solder material carrier such that a solder joint is formed between the solder material and at least one component or workpiece used as a carrier for the solder material In the method of manufacturing a solder joint in which a component of is heated in the melting chamber 12 which is a process atmosphere sealed from the surrounding environment, the next step is that in the cooling chamber 13 in which the component is a process atmosphere that is sealed with the surrounding environment. In which the components are heated and cooled in process chambers 12 and 13 independent of each other.
    公开号:KR20020062935A
    申请号:KR1020027005763
    申请日:2000-11-02
    公开日:2002-07-31
    发明作者:웨버스테판；켐퍼알프레드
    申请人:핑크 게엠베하 바쿠움테크니크；
    IPC主号:
    专利说明:

    Method and device for manufacturing solder joints
    [2] A method or apparatus of the above-mentioned type is known from DE 29 08 829 C3, which describes a method for performing a robust soldering procedure in an empty process chamber. Here, the components are connected to each other by melting solid solders connected to each other. During the solid soldering procedure, a vacuum is formed in the process chamber and approximately 600 [deg.] C. heats the interconnected components.
    [3] Subsequent cooling procedures in this method are performed outside the process chamber, which is a normal atmospheric environment.
    [1] BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a method of heat-treating a workpiece or component, and more particularly, by melting a solder material disposed on a solder material carrier and at least one configuration used as the solder material carrier. A method of manufacturing a solder joint in which at least one component is heated in a process atmosphere that is sealed from the surrounding environment such that a soldered joint is made between the elements or the workpiece. In addition, the present invention relates to an apparatus applied for performing such a method.
    [26] 1 is a schematic perspective view showing one embodiment of a device according to the present invention.
    [27] 2 is a longitudinal cross-sectional view of the apparatus of FIG. 1.
    [28] 3 is a schematic diagram illustrating a door mechanism.
    [29] 4A shows an embodiment of a copying apparatus in a basic state.
    [30] 4B shows the copying apparatus described in FIG. 3A in a heated state.
    [31] 4C shows the copying apparatus described in FIG. 3A in a temperature controlled state.
    [4] It is an object of the present invention to provide a method and apparatus for heating a component, in particular melting of solder material, as well as cooling of the component within a defined process atmosphere, without mutual damage of the heating and cooling procedures.
    [5] The solder joint manufacturing method of the present invention for achieving this object is the heating step of the component in the ambient environment and the closed process atmosphere, and then the cooling step proceeds procedurally, which is configured in a separate process chamber Heating of the element or melting of the solder material and cooling of the component occurs.
    [6] The process according to the invention basically uses heat treatment applications such as tempering, annealing on the workpiece or component basically. Part of this application is the production of solder joints that can be designed as rigid solder joints and flexible solder joints, such as in the manufacture of electronics and assemblies.
    [7] The production of solder joints by the method according to the invention is characterized by the fact that the soldering procedures include a cooling procedure that is controlled similarly to the melting procedure without affecting each other, as well as a cooling procedure that is the basis of the process chamber designated for these operations in each case. Enable effective implementation
    [8] The mutual influence between the two procedures should be avoided because it allows for the formation of different process atmospheres in various process chambers. In order to improve the quality of the solder joints, cooling should be performed in a defined process atmosphere. This is better when the solder joints have not only mechanical connections, such as the connection between metal elements, but also electrical connections, as in the case of boards suitable for electronic elements of the surface-mounted device (SMD) method. It may be desirable. Here, the electronic elements of the SMD method are connected by solder joints so that the strip conductors of the board are mechanically and electrically energized.
    [9] The method according to the invention for mechanically connecting a metal element to a solder joint is applied and / or radiated to a reducing or inert process atmosphere, in particular in a process chamber separated at the stage prior to melting of the solder material. Alternatively, it is useful when the solder material carrier is provided by application of heat transfer through the material. This makes it possible to prepare the solder material carrier as in the case of metal elements without damaging the process atmosphere which is particularly suitable for the subsequent melting procedure. For this purpose, a reducing agent such as formic acid or the like may be introduced into the process chamber, or the inside of the process chamber may be in a reducing gas atmosphere. This allows the process chamber to be cleaned to counteract the effects of the process atmosphere formed within the next process chamber before the solder material carriers or components to be joined together are transferred to the next process chamber to perform the melting procedure. The preparation of such solder material carriers or interconnected components will also benefit from the plasma application of the wetted contact surface by the solder material in this component or in the subsequent melting procedure.
    [10] More possibilities for canceling the mutual influence of various process atmospheres formed in various process chambers can be obtained by allowing each process atmosphere or process chamber interior to be in a vacuum state.
    [11] The process atmosphere inside each process chamber as a protective gas atmosphere can also be created. The realization of the simplest method for controlling the temperature of the component will be possible if the temperature application is effected by a tempering device that heats or cools the component to a substantially constant temperature. This makes it possible to shorten the overall process time since the heating and cooling time of the tempering device does not apply to the continuously operating tempering device.
    [12] In order to shorten the tempering time or to increase the tempering rate, the heat of the tempering apparatus will preferably be chosen higher than the required process or soldering temperature.
    [13] The simplest method for controlling the temperature of the solder material and / or solder material carrier when the solder joint is made will likewise be enabled by heat application.
    [14] It would be desirable if the tempering device was operated as a copying device and if the temperature of the component or solder material carrier was adjusted to the distance from the component or solder material carrier to the copying device.
    [15] If the radiating device is coupled with the contact device 33 and heat application takes place within at least one starting phase of heating or cooling by the transfer of heat or cold air, then a significant shortening of the heating and cooling time will be possible. will be.
    [16] The apparatus according to the invention for carrying out the above-mentioned method has a heating chamber or melting for melting the solder material for heating the component, in particular for the manufacture of solder joints arranged on the component used as the solder material carrier. A cooling chamber having a chamber, for cooling the components attached to the melting chamber, is connected with the heating chamber or the melting chamber 12, whereby the heating chamber or the melting chamber and the cooling chamber form independent process chambers. .
    [17] A preparation chamber 11 formed as a process chamber independent of the melting chamber 12 is disposed in front of the melting chamber 12 to prepare the solder material carrier for the solder joint.
    [18] If the process chamber is designed as modular units that can be connected to one another via a door mechanism, the device according to the invention will be readily adapted to the construction of various methods. Therefore, as one special case, for example, the apparatus of the present invention will consist of a melting chamber and a cooling chamber just as required. And in other cases it consists of a preparation chamber, a melting chamber and a cooling chamber, whereby the same modular unit can be used in at least partly configuring each device.
    [19] This also allows the process chamber to be completed in a modular fashion, whereby the door mechanism is a door module that can be combined with a chamber module to form the process chamber. Is designed.
    [20] Having a radiating device capable of varying the correlation distance with the carrier device or component by means of a distance varying device for applying heat to a component disposed on the carrier device in the process chamber formed by the heating chamber or the melting chamber; It is preferable. This thermal application device is designed to enable the copying device to operate essentially at a constant temperature, whereby the distance of the copying device associated with the carrier device can be changed by changing the temperature of the carrier device heated by the copying device.
    [21] Accelerated heating of the carrier device is required, so that if the residence time of the solder material carrier required for performing the melting in the melting chamber or for cooling in the cooling chamber is shortened overall, the radiation is separated by radiation. It is desirable to provide a radiating device having a contact device capable of transferring heat therein and also transferring heat through heat conduction.
    [22] The simplest design of the copying device for simultaneously forming the contacting device will be feasible if the copying device is designed as a temperable plate and its surface is provided as the contacting device.
    [23] In order to define the distance from the carrier device to the copying device depending on the required temperature of the carrier device, a temperature sensor is provided which provides an output signal to define various corrections for the distance change of the copying device associated with the carrier device. It is desirable to provide a carrier device or a solder material carrier having. This temperature sensor, which is provided for determining the temperature of the carrier device, may for example be arranged directly on a copying device such as a plate. Thus, contact with the carrier device may be ensured by a connecting device that compensates for the modified distance between the plate and the carrier device, for example a spring device independent of the angular distance between the carrier and the plate. Can be.
    [24] In particular, when the method according to the invention is designed in a continuous process, the solder material carriers arranged on the carrier device are guided through separate process chambers which are attached to one another and arranged in series. It is suitable for a carrier device having an information carrier which interacts with the reading device, and the process proceeds after the carrier device enters the first process chamber and manages the process chambers continuously arranged by the information contained on the information carrier. .
    [25] If the device comprising the at least one heating chamber and the cooling chamber is integrated into a work or production line as a partial device in a serial arrangement, economical application of the device will be realized. For example, the SMD board may be connected to the device when the device for producing an SMD board is used as a mounting device for mounting.
    [32] 1 shows a soldering apparatus 10 having a plurality of process chambers arranged in succession, that is, a preparation chamber 11, a melting chamber 12 and a cooling chamber. The separate process chambers 11, 12, 13 are connected to each other by door mechanisms 14, 15, and in this embodiment, in addition to the external process chambers 11, 13, the carrier device shown in FIG. 2, respectively. The door mechanisms 16 and 17 are provided for the entry and exit of the device 18. Solder material carriers are disposed on a carrier device 18 (more detailed description is omitted) provided soldering on the solder joint by melting the solder material.
    [33] As shown in FIG. 1, the individual process chambers 11, 12, 13 have at least one door mechanism 14, 15, 16, which are combined with the chamber modules 21, 22, 23 to form their respective process chambers. It is designed as modular type with chamber module complete by 17). As can be clearly seen from the successive arrangement of all three process chambers to form the soldering apparatus 10 shown in FIG. 1, the other is complete by connecting different process chambers in a modular type and not connected to expand the process. Partial processes can be connected, and are operated as a preparatory chamber 11, a melting chamber 12, and a cooling chamber 13 as separate partial processes of the entire process that are not coupled to each other.
    [34] As shown in FIG. 2, in one embodiment according to the present invention, a solder material carrier or carriers (detailed description) are first prepared into the preparation chamber 11 in the first step. In order for the carrier device 18 to be guided into the preparation chamber 11, a reducing agent is added to the preparation chamber 11 to empty the preparation chamber 11 and / or to create a desired process atmosphere. As a result, the solder material carriers (not described in detail) are metal components joined together by solder joints, and may create a reducing process atmosphere by adding formic acid in the preparation chamber 11. After the required reduction result is achieved, the preparation chamber 11 can be cleaned by nitrogen / hydrogen mixed gas.
    [35] The carrier device 18 shown in FIG. 2 not only retracts the carrier device 18 into the preparation chamber 11 via the open door mechanism 16, but also the carrier device 18 after the door mechanism 15 is opened. Is arranged on the conveying device 27 in the preparation chamber 11 to be transported to the melting chamber 12. In the melting chamber 12, for example, a carrier atmosphere 18 is formed at a required solder temperature after forming a reducing atmosphere or an inert atmosphere according to the formation of a protective gas atmosphere in the melting chamber 12, and then a required processing atmosphere is provided. Heating is carried out. This heating is performed by a heating device 24 having a hot plate 26 disposed on the elevating mechanism 25.
    [36] 3 is an exemplary view showing the structure of the door mechanism (14, 15, 16). The door mechanism 14 independently seals the process chambers 11, 12, 13 to create pressure to create various process atmospheres formed in the process chambers 11, 12, 13 (FIG. 2). Can be. The door mechanism 14 has an actuating device 39 composed of a pair of actuating cylinders, a guide device 40 and a door panel 41, wherein the guide device 40 opens the door of the process chamber wall 43. The door 42 may be moved toward or away from the door opening 42. In FIG. 3, a door panel 41 is located directly in front of the process chamber wall 43. As shown in FIG. The guide device 40 includes a slide rod disposed in parallel with a horizontal plane of the door opening part 42 including a pair of knee levers 45 guided by a slide block 46. 44). To move the door panel 41 from the open position to the closed position, the slide block 46 begins to move downward from the upper slide stop 47 until it reaches the lower slide stop 48. The operating cylinder piston 49 operates directly on the pair of joint levers 45 and the door panel 41 moves toward the process chamber wall 43 until the seal is completely sealed.
    [37] Possible structures of the heating device 24 and their functions are described in detail in FIGS. 4A-4C. In the heating device 24 in the basic form shown in FIG. 4A, a hot plate 26 is located at a distance d1 at the bottom of the carrier device 18. The carrier device 18 is a heating device for the transport device 27 in the present invention formed by feed billets 28, 29 which are rotated in the vicinity of the process chambers 11, 12, 13. Hanging in the correlation position compared to 24).
    [38] The hot plate 26 of the present invention is arranged on a hoist mechanism 25 having two lifting rams 30 and a temperature sensor 32 located in the spring device 31. . In the basic situation of FIG. 4A, since the spring device 31 is not pressurized, the temperature sensor 32 protrudes out of the contact surface 33 of the hot plate 26.
    [39] In the heating device 24 in the heating mode shown in FIG. 4B, the contact surface 33 of the hot plate 26 is located on the bottom face 34 of the carrier device 18, and heat is transferred from the hot plate 26 by heat transfer. It is effectively delivered to the carrier device 18. The temperature sensor 32 is located in a position where the contact surface 33 is sunk, while the sensor surface 35 of the temperature sensor 32 is exposed at the contact surface 33 so that the bottom surface of the carrier device 18 ( In close contact with 34). The hot plate 26 is operated at the contact temperature as shown in FIG. 4B and the temperature sensor 32 remains in the contact position until the required temperature of the carrier device 18 is determined. Next, the hot plate 26 is moved to the temperature regulation state shown in Fig. 4C. Here, the contact surface 33 of the hot plate 26 is located at a distance d2 at the bottom of the carrier device 18, and the temperature sensor 32, which has been trapped by the spring device 31, is the sensor surface of the carrier device 18. It remains in contact with 35. In the temperature control state of the hot plate 26 described above, the hot plate 26 can act as a radiator and absorb heat to the carrier device 18 through radiation. The change in the distance d2 between the bottom face 34 of the carrier device 18 and the contact surface 33 of the hot plate 26 is a setting device (a detailed description is omitted) that is related to the nominal temperature of the carrier device. It is determined by the difference in temperature determined by 32). Here, the nominal temperature of the carrier device 18 is a temperature for maintaining the residence time of the carrier device 18 required to perform the melting process in the melting chamber 12 or more.
    [40] The distance adjustment is by means of a distance adjuster providing feed billets 28 and 29 in place of the elevator 50 operated on the transporter 27 or the elevator 25 operated on the hotplate as shown in FIG. 4A. Is done. A requirement for temperature control of the hotplate 26, which is essentially operated at a constant temperature, is the possibility of a relative distance change between the hotplate 26 and the carrier device 18 or the solder material carrier.
    [41] As shown in FIGS. 4A-4C, the effect of the heating device 24 is more complete, for example, by adding a heating device such as radiant panel heating 36 disposed on top of the carrier device 18. Can be done. The radiation panel heating 36 may also provide distance control consistent with the operating method for distance management of the heating device 24.
    [42] As shown in FIG. 2, the carrier device 18 in which the melting step in the melting chamber 12 is completed is moved to the cooling chamber 13, where a process atmosphere that is different from or coincident with the process atmosphere in the melting chamber is formed. do. The cooling chamber 13 provides a cooling device 37 which is partially coincident with the distance control by its own design and operating method of the heating device 24 described in detail in FIGS. 4A-4C. The cooling device 37 can define the cooling of the carrier device 18 by, for example, a combination of cooling radiation and cooling divergence as a result of the set cooling curve. The similarity between the heater 24 and the chiller 37 is that they operate at a constant temperature. Here, the temperature of the carrier device 18 may be affected by the distance adjustment or change between the cooling plate 38 and the carrier device 18.
    [43] As mentioned above, the solder joint manufacturing method and apparatus according to the present invention allow the heating of the component without damaging the heating procedure and the cooling procedure, in particular the melting of the solder material, as well as the cooling of the component within a defined process atmosphere. Get the effect.
    [44] As described above, the present invention has been described only with respect to specific examples, but it will be apparent to those skilled in the art that various changes and modifications can be made within the technical spirit of the present invention based on the above specific examples. And modifications belong to the appended claims.
    权利要求:
    Claims (16)
    [1" claim-type="Currently amended] Among the methods of heat-treating a workpiece or component, in particular, the solder material disposed on the solder material carrier is melted so that a solder joint can be produced between the solder material and at least one component or workpiece used as the carrier of the solder material. In a method of manufacturing a solder joint in which one component is heated in a closed process atmosphere from the surrounding environment,
    In a next step, the method is characterized in that the component is cooled in a process atmosphere enclosed with the surrounding environment, whereby the components are heated and cooled in a process chamber (12, 13) independent of each other.
    [2" claim-type="Currently amended] The solder joint according to claim 1, wherein in the pre-heating stage of the component, the component is prepared via material or radiation and / or by application of a reducing or inert process atmosphere in a separate process chamber (11). Manufacturing method.
    [3" claim-type="Currently amended] The method of claim 1 or 2, wherein a vacuum is formed in the process atmosphere or the process chamber (11, 12, 13).
    [4" claim-type="Currently amended] 4. The method of any one of claims 1 to 3, wherein the process atmosphere is designed as a protective gas atmosphere.
    [5" claim-type="Currently amended] 4. The application of any of claims 1 to 3, wherein the heat application for heating and / or cooling the components is by means of tempering devices 24, 37, which can be heated or cooled. The tempering device for the solder joint manufacturing method characterized in that it is operated at a constant temperature.
    [6" claim-type="Currently amended] 6. The method of claim 5 wherein the tempering device is operated as a copying device and the temperature of the component is controlled by the distance from the component to the copying device.
    [7" claim-type="Currently amended] 7. The radiation device of claim 6, wherein the radiation device (24, 37) is coupled to the contact device (33), wherein heat application occurs in at least one starting phase of hot or cold air by transfer of heat or cold air. The solder joint manufacturing method.
    [8" claim-type="Currently amended] The heating takes place in the component, and in particular, as claimed in claim 1 having a heating chamber or melting chamber for melting of the solder material for the manufacture of solder joints disposed on the component used as the solder material carrier. In the solder joint manufacturing apparatus for bringing the effect of the method,
    A cooling joint 3 for cooling the component is connected with the heating chamber or the melting chamber 12, whereby the heating chamber or the melting chamber and the cooling chamber form a process chamber independent of each other. Device.
    [9" claim-type="Currently amended] 9. The soldering chamber of claim 8, wherein the preparation chamber (11) formed as a process chamber independent of the melting chamber (12) is disposed in front of the melting chamber (12) to prepare a solder material carrier for a solder joint. Joint manufacturing device.
    [10" claim-type="Currently amended] The solder joint according to claim 8 or 9, characterized in that the process chambers (11, 12, 13) are designed as module units which can be connected to one another via door mechanisms (14, 15, 16, 17). Manufacturing equipment.
    [11" claim-type="Currently amended] The process chamber (11, 12, 13) is designed in a module type, and the door mechanism (14, 15, 16, 17) is a chamber module (21, 22, 23) for forming the process chamber. The solder joint manufacturing apparatus, characterized in that it is designed as a door module that can be combined with.
    [12" claim-type="Currently amended] 12. The process according to any one of claims 8 to 11, wherein at least the process chamber is provided as a heating chamber or a melting chamber 12 or the process chamber is adapted for applying heat to a component disposed on the carrier device 18. Provided with a cooling chamber having a copying device (24, 37), whereby the copying device is characterized in that the distance between the carrier device (18) or components can be varied by means of a distance changer. Device.
    [13" claim-type="Currently amended] 13. The apparatus of claim 12, wherein the copying device (24, 37) has a contact device (33) for applying heat to the component or carrier device (18) by heat dissipation.
    [14" claim-type="Currently amended] 14. The solder joint manufacturing apparatus according to claim 12 or 13, wherein the copying device (24, 37) is provided with a temperable plate (26, 38) whose surface is used as a contacting device (33).
    [15" claim-type="Currently amended] 15. The carrier according to any one of claims 12 to 14, wherein the carrier device (18) is output to define various corrections for the distance change of the copying devices (24, 37) associated with the carrier device (18). And a temperature sensor (32) for providing a signal.
    [16" claim-type="Currently amended] 12. The carrier device (1) according to any one of claims 8 to 11, wherein the carrier device (18) is provided as an information carrier which interacts with the reading device, whereby the carrier device (18) is provided with a first process chamber (11, 12, 13) The solder joint manufacturing apparatus according to claim 1, wherein the process proceeding in the first process chamber and then in the process chamber disposed therein is controlled by information contained on the information carrier.
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    同族专利:
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    DE19953654A1|2001-05-23|
    ES2243338T3|2005-12-01|
    PL194904B1|2007-07-31|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1999-11-08|Priority to DE19953654A
    1999-11-08|Priority to DE19953654.6
    2000-11-02|Application filed by 핑크 게엠베하 바쿠움테크니크
    2002-07-31|Publication of KR20020062935A
    2006-11-13|Application granted
    2006-11-13|Publication of KR100645984B1
    优先权:
    申请号 | 申请日 | 专利标题
    DE19953654A|DE19953654A1|1999-11-08|1999-11-08|Method and device for producing a solder connection|
    DE19953654.6|1999-11-08|
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